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High Temperature Conference Papers
Vol. 2017, Issue HiTEN, 2017
July 01, 2017 EDT
Effects of Bond Pad Thickness on Shear Strength of Copper Wire Bonds
Subramani Manoharan
,
Chandradip Patel
,
Stevan Hunter
,
Patrick McCluskey
,
bond pad thickness
shear strength
copper wire bonds
cu wire
•
https://doi.org/10.4071/2380-4491.2017.HiTEN.68
IMAPSource Conference Papers
Manoharan, Subramani, Chandradip Patel, Stevan Hunter, and Patrick McCluskey. 2017. “Effects of Bond Pad Thickness on Shear Strength of Copper Wire Bonds.”
IMAPSource Proceedings
2017 (HiTEN): 68–73.
https://doi.org/10.4071/2380-4491.2017.HiTEN.68
.
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