Effects of Bond Pad Thickness on Shear Strength of Copper Wire Bonds

Subramani Manoharan; Chandradip Patel; Stevan Hunter; Patrick McCluskey

doi:10.4071/2380-4491.2017.HiTEN.68

Loading [Contrib]/a11y/accessibility-menu.js

Manoharan, Subramani, Chandradip Patel, Stevan Hunter, and Patrick McCluskey. 2017. “Effects of Bond Pad Thickness on Shear Strength of Copper Wire Bonds.” IMAPSource Proceedings 2017 (HiTEN): 68–73. https://doi.org/10.4071/2380-4491.2017.HiTEN.68.

View more stats