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High Temperature Conference Papers
Vol. 2017, Issue HiTEN, 2017July 01, 2017 EDT

Microstructure stability of TLPS interconnects in high operating temperature applications

Catherine Shearer,
Transient liquid phase sintering solder replacement high operating temperature interconnect microstructure
• https://doi.org/10.4071/2380-4491.2017.HiTEN.226
IMAPSource Conference Papers
Shearer, Catherine. 2017. “Microstructure Stability of TLPS Interconnects in High Operating Temperature Applications.” IMAPSource Proceedings 2017 (HiTEN): 226–33. https://doi.org/10.4071/2380-4491.2017.HiTEN.226.
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