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High Temperature Conference Papers
Vol. 2017, Issue HiTEN, 2017July 01, 2017 EDT

Evaluation of Thermal Resistance Degradation of SiC Power Module Corresponding to Thermal Cycle Test

Fumiki Kato, Hiroki Takahashi, Hidekazu Tanisawa, Kenichi Koui, Shinji Sato, Yoshinori Murakami, Hiroshi Nakagawa, Hiroshi Yamaguchi, Hiroshi Sato,
250°C operating SiC power module Zn-Al eutectic solder transient thermal analysis
• https://doi.org/10.4071/2380-4491.2017.HiTEN.223
IMAPSource Conference Papers
Kato, Fumiki, Hiroki Takahashi, Hidekazu Tanisawa, Kenichi Koui, Shinji Sato, Yoshinori Murakami, Hiroshi Nakagawa, Hiroshi Yamaguchi, and Hiroshi Sato. 2017. “Evaluation of Thermal Resistance Degradation of SiC Power Module Corresponding to Thermal Cycle Test.” IMAPSource Proceedings 2017 (HiTEN): 1–5. https://doi.org/10.4071/2380-4491.2017.HiTEN.223.
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