ISSN 2380-4505
Vol. 2017, Issue NOR, 2017July 01, 2017 EDT
Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance
Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance
Selin Tolunay Wipf, Alexander Göritz, Matthias Wietstruck, Maurizio Cirillo, Christian Wipf, Kai Zoschke, Mehmet Kaynak,
Articles in Vol. 2017, Issue NOR, 2017
Vol. 2017, Issue NOR, 2017
- Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performanceSelin Tolunay WipfAlexander GöritzMatthias WietstruckMaurizio CirilloChristian WipfKai ZoschkeMehmet Kaynak
- D-band Waveguide Transition Based on Linearly Tapered Slot AntennaAhmed HassonaZhongxia Simon HeVessen VassilevHerbert Zirath
- RF Modules (Tx–Rx) with Multifunctional MMICsMartin OppermannRalf Rieger
- Liquid Cooling in an LTCC-Module for a Switched Mode AmplifierPeter UhligAlexandra SerwaUlrich AltmannTilo WelkerJens MüllerDieter SchwankeJürgen PohlnerThomas Rittweg
- Fabrication and Characterization of Screen Printed Stretchable Carbon InterconnectsMahmoud MosallaeiBehnam KhorramdelMari HonkanenPekka Iso-KetolaJukka VanhalaMatti Mäntysalo
- An FPGA-based monitoring system for reliability analysisChristian JohanssonJonas ArwidsonTorbjörn Månefjord
Wipf, Selin Tolunay, Alexander Göritz, Matthias Wietstruck, Maurizio Cirillo, Christian Wipf, Kai Zoschke, and Mehmet Kaynak. 2017. “Effect of Wafer-Level Silicon Cap Packaging on BiCMOS Embedded RF-MEMS Switch Performance.” IMAPSource Proceedings 2017 (NOR): 1–4. https://doi.org/10.4071/2017-NOR-Wipf.