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Symposium Proceedings
Vol. 2010, Issue 1, 2010January 01, 2010 EDT

Advanced Thin Wafer Support Processes for Temporary Wafer Bonding

Jeremy McCutcheon, Dongshun Bai,
silicon wafer bonding temporary wafer bonding thin wafer support through-silicon vias TSVs semiconductor wafer bonding
• https://doi.org/10.4071/isom-2010-WA1-Paper2
IMAPSource Conference Papers
McCutcheon, Jeremy, and Dongshun Bai. 2010. “Advanced Thin Wafer Support Processes for Temporary Wafer Bonding.” IMAPSource Proceedings 2010 (1): 361–63. https://doi.org/10.4071/isom-2010-WA1-Paper2.
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