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Symposium Proceedings
Vol. 2010, Issue 1, 2010January 01, 2010 EDT

Advanced Thin Wafer Support Processes for Temporary Wafer Bonding

Jeremy McCutcheon, Dongshun Bai,
silicon wafer bondingtemporary wafer bondingthin wafer supportthrough-silicon viasTSVssemiconductor wafer bonding
https://doi.org/10.4071/isom-2010-WA1-Paper2
IMAPSource Conference Papers
McCutcheon, Jeremy, and Dongshun Bai. 2010. “Advanced Thin Wafer Support Processes for Temporary Wafer Bonding.” IMAPSource Proceedings 2010 (1): 361–63. https:/​/​doi.org/​10.4071/​isom-2010-WA1-Paper2.
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