Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Direct copper metallization on TGV (Thru-Glass-Via) for high performance glass substrate
Direct copper metallization on TGV (Thru-Glass-Via) for high performance glass substrate
ONITAKE, Shigeo, Kotoku INOUE, and Masatoshi TAKAYAMA. 2017. “Direct Copper Metallization on TGV (Thru-Glass-Via) for High Performance Glass Substrate.” IMAPSource Proceedings 2017 (1): 464–67. https://doi.org/10.4071/isom-2017-WP52_085.