Vol. 2020, Issue 1, 2020September 01, 2020 EDT
Evaluation of Emerging High Melting Point Lead-free Solder and Hybrid Sinter Paste as Attaching Material for Clip Bond Package
Evaluation of Emerging High Melting Point Lead-free Solder and Hybrid Sinter Paste as Attaching Material for Clip Bond Package
Le, Fred Fuliang, Rinse van der Meulen, Yoon Kheong Leong, Manoj Balakrishnan, and Zunyu Guan. 2020. “Evaluation of Emerging High Melting Point Lead-Free Solder and Hybrid Sinter Paste as Attaching Material for Clip Bond Package.” IMAPSource Proceedings 2020 (1): 235–41. https://doi.org/10.4071/2380-4505-2020.1.000235.