Interactions between Variable Frequency Microwave Underfill Processing and High Performance Packaging Materials

Mamadou Diobet Diop; Marie-Claude Paquet; Dominique Drouin; David Danovitch

doi:10.4071/isom-2013-WA21

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Diop, Mamadou Diobet, Marie-Claude Paquet, Dominique Drouin, and David Danovitch. 2013. “Interactions between Variable Frequency Microwave Underfill Processing and High Performance Packaging Materials.” IMAPSource Proceedings 2013 (1): 461–66. https://doi.org/10.4071/isom-2013-WA21.

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