Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Interactions between Variable Frequency Microwave Underfill Processing and High Performance Packaging Materials
Interactions between Variable Frequency Microwave Underfill Processing and High Performance Packaging Materials
Diop, Mamadou Diobet, Marie-Claude Paquet, Dominique Drouin, and David Danovitch. 2013. “Interactions between Variable Frequency Microwave Underfill Processing and High Performance Packaging Materials.” IMAPSource Proceedings 2013 (1): 461–66. https://doi.org/10.4071/isom-2013-WA21.