Vol. 2014, Issue 1, 2014January 01, 2014 EDT
A Case Study of the Reliability of Copper Bond Wires In Plastic Encapsulated Integrated Circuits
A Case Study of the Reliability of Copper Bond Wires In Plastic Encapsulated Integrated Circuits
Turner, Ken. 2014. “A Case Study of the Reliability of Copper Bond Wires In Plastic Encapsulated Integrated Circuits.” IMAPSource Proceedings 2014 (1): 804–9. https://doi.org/10.4071/isom-THP15.