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Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications

Xin Zhao, K. Jagannadham, Wuttichai Reainthippayasakul, Michael. T. Lanagan, Douglas C. Hopkins,
ultra-thin 3YSZflexible substrateelectronic packagingthermal conductivitydielectric breakdownrelative permittivity
https://doi.org/10.4071/isom-2016-THA13
IMAPSource Conference Papers
Zhao, Xin, K. Jagannadham, Wuttichai Reainthippayasakul, Michael. T. Lanagan, and Douglas C. Hopkins. 2016. “Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications.” IMAPSource Proceedings 2016 (1): 391–96. https:/​/​doi.org/​10.4071/​isom-2016-THA13.
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