Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Cost Comparison of Fan-out Wafer-Level Packaging to Fan-out Panel-Based Packaging
Cost Comparison of Fan-out Wafer-Level Packaging to Fan-out Panel-Based Packaging
Palesko, Chet, and Amy Lujan. 2016. “Cost Comparison of Fan-out Wafer-Level Packaging to Fan-out Panel-Based Packaging.” IMAPSource Proceedings 2016 (1): 180–84. https://doi.org/10.4071/isom-2016-WA32.
Powered by Scholastica, the modern academic journal management system