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Symposium Proceedings
Vol. 2018, Issue 1, 2018
October 01, 2018 EDT
Additive Manufacturing for Multi-chip Modules
Zhenzhen Shen
,
Aleksey Reiderman
,
Additive Manufacturing
multi-chip module (MCM)
process
reliability
•
https://doi.org/10.4071/2380-4505-2018.1.000760
IMAPSource Conference Papers
Shen, Zhenzhen, and Aleksey Reiderman. 2018. “Additive Manufacturing for Multi-Chip Modules.”
IMAPSource Proceedings
2018 (1): 760–66.
https://doi.org/10.4071/2380-4505-2018.1.000760
.
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