Vol. 2016, Issue 1, 2016October 01, 2016 EDT
A deeper understanding on the motion behaviors of wire during ultrasonic wedge-wedge bonding process
A deeper understanding on the motion behaviors of wire during ultrasonic wedge-wedge bonding process
Long, Yangyang, Folke Dencker, Marc Wurz, Armin Feldhoff, and Jens Twiefel. 2016. “A Deeper Understanding on the Motion Behaviors of Wire during Ultrasonic Wedge-Wedge Bonding Process.” IMAPSource Proceedings 2016 (1): 427–32. https://doi.org/10.4071/isom-2016-THA31.