Voiding and Reliability of Assembly of BGA with SAC and 57Bi42Sn1Ag Alloys

Yan Liu; Joanna Keck; Erin Page; Ning-Cheng Lee

doi:10.4071/isom-2013-TA46

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Liu, Yan, Joanna Keck, Erin Page, and Ning-Cheng Lee. 2013. “Voiding and Reliability of Assembly of BGA with SAC and 57Bi42Sn1Ag Alloys.” IMAPSource Proceedings 2013 (1): 128–39. https://doi.org/10.4071/isom-2013-TA46.

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