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Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

Sandwich Structured Power Module for High Temperature SiC Power Semiconductor Devices

Takeshi ANZAI, Yoshinori MURAKAMI, Shinji SATO, Hidekazu TANISAWA, Kohei HIYAMA, Hiroki TAKAHASHI, Fumiki KATO, Hiroshi SATO,
SiC High temperature Warpage Power module SiN substrate baseplate
• https://doi.org/10.4071/isom-WP54
IMAPSource Conference Papers
ANZAI, Takeshi, Yoshinori MURAKAMI, Shinji SATO, Hidekazu TANISAWA, Kohei HIYAMA, Hiroki TAKAHASHI, Fumiki KATO, and Hiroshi SATO. 2014. “Sandwich Structured Power Module for High Temperature SiC Power Semiconductor Devices.” IMAPSource Proceedings 2014 (1): 757–62. https://doi.org/10.4071/isom-WP54.
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