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Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

Optimization of Cupric Chloride Subtractive Etching for Cu High Density Interconnects

Alexander Lambert, Goutham Issac, Ashish Salunke, Luwen Lu, Oliver Chyan,
UV-Vis SpectroscopySubtractive Copper etchingpost etchregenerationrestoration
https://doi.org/10.4071/2380-4505-2018.1.000640
IMAPSource Conference Papers
Lambert, Alexander, Goutham Issac, Ashish Salunke, Luwen Lu, and Oliver Chyan. 2018. “Optimization of Cupric Chloride Subtractive Etching for Cu High Density Interconnects.” IMAPSource Proceedings 2018 (1): 640–46. https:/​/​doi.org/​10.4071/​2380-4505-2018.1.000640.
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