Optimization of Cupric Chloride Subtractive Etching for Cu High Density Interconnects

Alexander Lambert; Goutham Issac; Ashish Salunke; Luwen Lu; Oliver Chyan

doi:10.4071/2380-4505-2018.1.000640

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Lambert, Alexander, Goutham Issac, Ashish Salunke, Luwen Lu, and Oliver Chyan. 2018. “Optimization of Cupric Chloride Subtractive Etching for Cu High Density Interconnects.” IMAPSource Proceedings 2018 (1): 640–46. https://doi.org/10.4071/2380-4505-2018.1.000640.

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