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Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

Consumable and Process Improvement for Large Copper Wire Bonding

Tao Xu, Todd Walker, Bernard Poncelet, Jason Fu, Christoph Luechinger,
Copper wire bondingultrasonic wedge bondingconsumable lifetimeprocess improvement
https://doi.org/10.4071/isom-2016-THA34
IMAPSource Conference Papers
Xu, Tao, Todd Walker, Bernard Poncelet, Jason Fu, and Christoph Luechinger. 2016. “Consumable and Process Improvement for Large Copper Wire Bonding.” IMAPSource Proceedings 2016 (1): 445–49. https:/​/​doi.org/​10.4071/​isom-2016-THA34.
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