Bernt, Marvin, Paul Van Valkenburg, David Surdock, and Prayudi Lianto. 2018. “Enabling a Robust Copper Seed Etch Process for Fine Line RDL by Electroplating on a Thin PVD Seed Layer.” IMAPSource Proceedings 2018 (1): 207–11. https://doi.org/10.4071/2380-4505-2018.1.000207.