Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Enabling a Robust Copper Seed Etch Process for Fine Line RDL by Electroplating on a Thin PVD Seed Layer
Enabling a Robust Copper Seed Etch Process for Fine Line RDL by Electroplating on a Thin PVD Seed Layer
Bernt, Marvin, Paul Van Valkenburg, David Surdock, and Prayudi Lianto. 2018. “Enabling a Robust Copper Seed Etch Process for Fine Line RDL by Electroplating on a Thin PVD Seed Layer.” IMAPSource Proceedings 2018 (1): 207–11. https://doi.org/10.4071/2380-4505-2018.1.000207.
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