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Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

Production Proven, High Precision Temporary Bond/De-bond Process

Blake Dronen, Aric Shorey, B.K. Wang, Leon Tsai,
Wafer thinningstack TTV3M Wafer Support System glass carriers
https://doi.org/10.4071/isom-2013-THP35
IMAPSource Conference Papers
Dronen, Blake, Aric Shorey, B.K. Wang, and Leon Tsai. 2013. “Production Proven, High Precision Temporary Bond/De-Bond Process.” IMAPSource Proceedings 2013 (1): 861–65. https:/​/​doi.org/​10.4071/​isom-2013-THP35.

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