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Symposium Proceedings
Vol. 2013, Issue 1, 2013
January 01, 2013 EDT
Production Proven, High Precision Temporary Bond/De-bond Process
Blake Dronen
,
Aric Shorey
,
B.K. Wang
,
Leon Tsai
,
Wafer thinning
stack TTV
3M Wafer Support System glass carriers
•
https://doi.org/10.4071/isom-2013-THP35
IMAPSource Conference Papers
Dronen, Blake, Aric Shorey, B.K. Wang, and Leon Tsai. 2013. “Production Proven, High Precision Temporary Bond/De-Bond Process.”
IMAPSource Proceedings
2013 (1): 861–65.
https://doi.org/10.4071/isom-2013-THP35
.
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