Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Design and Demonstration of 40 micron Bump Pitch Multi-layer RDL on Panel-based Glass Interposers
Design and Demonstration of 40 micron Bump Pitch Multi-layer RDL on Panel-based Glass Interposers
Sawyer, Brett, Yuya Suzuki, Zihan Wu, Hao Lu, Venky Sundaram, Kadappan Panayappan, and Rao Tummala. 2015. “Design and Demonstration of 40 Micron Bump Pitch Multi-Layer RDL on Panel-Based Glass Interposers.” IMAPSource Proceedings 2015 (1): 379–85. https://doi.org/10.4071/isom-2015-WP24.