Adhesion and Cure Mechanism Studies for Advanced Lidded Flip Chip Applications

Lyndon J. Larson; Kristen E. Steinbrecher

doi:10.4071/isom-2013-TP36

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Larson, Lyndon J., and Kristen E. Steinbrecher. 2013. “Adhesion and Cure Mechanism Studies for Advanced Lidded Flip Chip Applications.” IMAPSource Proceedings 2013 (1): 298–302. https://doi.org/10.4071/isom-2013-TP36.

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