A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series Diode

Adam Morgan; Ankan De; Haotao Ke; Xin Zhao; Kasunaidu Vechalapu; Douglas C. Hopkins; Subhashish Bhattacharya

doi:10.4071/isom-2015-WP17

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Morgan, Adam, Ankan De, Haotao Ke, Xin Zhao, Kasunaidu Vechalapu, Douglas C. Hopkins, and Subhashish Bhattacharya. 2015. “A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series Diode.” IMAPSource Proceedings 2015 (1): 359–64. https://doi.org/10.4071/isom-2015-WP17.

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