Vol. 2015, Issue 1, 2015October 01, 2015 EDT
A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series Diode
A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series Diode
Morgan, Adam, Ankan De, Haotao Ke, Xin Zhao, Kasunaidu Vechalapu, Douglas C. Hopkins, and Subhashish Bhattacharya. 2015. “A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series Diode.” IMAPSource Proceedings 2015 (1): 359–64. https://doi.org/10.4071/isom-2015-WP17.