Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Development of High Thermally Conductive Die Attach for TIM Applications
Development of High Thermally Conductive Die Attach for TIM Applications
Patelka, Maciej, Sho Ikeda, Koji Sasaki, Hiroki Myodo, and Nortisuka Mizumura. 2019. “Development of High Thermally Conductive Die Attach for TIM Applications.” IMAPSource Proceedings 2019 (1): 312–15. https://doi.org/10.4071/2380-4505-2019.1.000312.
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