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Symposium Proceedings
Vol. 2019, Issue 1, 2019October 01, 2019 EDT

Development of High Thermally Conductive Die Attach for TIM Applications

Maciej Patelka, Sho Ikeda, Koji Sasaki, Hiroki Myodo, Nortisuka Mizumura,
High ThermalsThermal InterfaceSintered SilverLow Modulus
https://doi.org/10.4071/2380-4505-2019.1.000312
IMAPSource Conference Papers
Patelka, Maciej, Sho Ikeda, Koji Sasaki, Hiroki Myodo, and Nortisuka Mizumura. 2019. “Development of High Thermally Conductive Die Attach for TIM Applications.” IMAPSource Proceedings 2019 (1): 312–15. https:/​/​doi.org/​10.4071/​2380-4505-2019.1.000312.
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