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Symposium Proceedings
Vol. 2012, Issue 1, 2012
January 01, 2012 EDT
Packaging of High Power UV-LED Modules on Ceramic and Aluminum Substrates
Marc Schneider
,
Benjamin Leyrer
,
Christian Herbold
,
Stefan Maikowske
,
UV-LED
high power density
alumina substrate
aluminum substrate
water cooling
•
https://doi.org/10.4071/isom-2012-TA66
IMAPSource Conference Papers
Schneider, Marc, Benjamin Leyrer, Christian Herbold, and Stefan Maikowske. 2012. “Packaging of High Power UV-LED Modules on Ceramic and Aluminum Substrates.”
IMAPSource Proceedings
2012 (1): 225–32.
https://doi.org/10.4071/isom-2012-TA66
.
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