Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Packaging of High Power UV-LED Modules on Ceramic and Aluminum Substrates
Packaging of High Power UV-LED Modules on Ceramic and Aluminum Substrates
Schneider, Marc, Benjamin Leyrer, Christian Herbold, and Stefan Maikowske. 2012. “Packaging of High Power UV-LED Modules on Ceramic and Aluminum Substrates.” IMAPSource Proceedings 2012 (1): 225–32. https://doi.org/10.4071/isom-2012-TA66.