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Symposium Proceedings
Vol. 2013, Issue 1, 2013
January 01, 2013 EDT
Multipurpose Wire Bonding – Bumps, Wires, Combination Interconnects, and Operation Efficiency
Daniel D. Evans
,
Wire Bond
Large Area
Deep Access
Hybrid
SIP
MCM
RF
Optoelectronic
Optical
Automotive
Ball Bump
Stud Bump
•
https://doi.org/10.4071/isom-2013-TP44
IMAPSource Conference Papers
Evans, Daniel D. 2013. “Multipurpose Wire Bonding – Bumps, Wires, Combination Interconnects, and Operation Efficiency.”
IMAPSource Proceedings
2013 (1): 324–30.
https://doi.org/10.4071/isom-2013-TP44
.
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