Multipurpose Wire Bonding – Bumps, Wires, Combination Interconnects, and Operation Efficiency

Daniel D. Evans

doi:10.4071/isom-2013-TP44

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Evans, Daniel D. 2013. “Multipurpose Wire Bonding – Bumps, Wires, Combination Interconnects, and Operation Efficiency.” IMAPSource Proceedings 2013 (1): 324–30. https://doi.org/10.4071/isom-2013-TP44.

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