Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging
Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging
Jiang, Tong, Fubin Song, Chaoran Yang, and S. W. Ricky Lee. 2010. “Nanoindentation Characterization of Lead-Free Solders and Intermetallic Compounds under Thermal Aging.” IMAPSource Proceedings 2010 (1): 314–18. https://doi.org/10.4071/isom-2010-TP4-Paper5.