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Symposium Proceedings
Vol. 2010, Issue 1, 2010January 01, 2010 EDT

Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging

Tong Jiang, Fubin Song, Chaoran Yang, S. W. Ricky Lee,
Lead-free solderintermetallic compoundnanoindentationthermal aging
https://doi.org/10.4071/isom-2010-TP4-Paper5
IMAPSource Conference Papers
Jiang, Tong, Fubin Song, Chaoran Yang, and S. W. Ricky Lee. 2010. “Nanoindentation Characterization of Lead-Free Solders and Intermetallic Compounds under Thermal Aging.” IMAPSource Proceedings 2010 (1): 314–18. https:/​/​doi.org/​10.4071/​isom-2010-TP4-Paper5.
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