Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Analysis of crack length and crack position in the Solder Joints of High Power LEDs by Transient Thermal Measurements and Finite Element Simulations
Analysis of crack length and crack position in the Solder Joints of High Power LEDs by Transient Thermal Measurements and Finite Element Simulations
Kandaswamy, Shri Vishnu, Ulrich Tetzlaff, Robert Derix, and Gordon Elger. 2014. “Analysis of Crack Length and Crack Position in the Solder Joints of High Power LEDs by Transient Thermal Measurements and Finite Element Simulations.” IMAPSource Proceedings 2014 (1): 55–61. https://doi.org/10.4071/isom-TA25.
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