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Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

Analysis of crack length and crack position in the Solder Joints of High Power LEDs by Transient Thermal Measurements and Finite Element Simulations

Shri Vishnu Kandaswamy, Ulrich Tetzlaff, Robert Derix, Gordon Elger,
Reliability of High power LEDs Transient thermal analysis Analysis of crack influences in solder joint
• https://doi.org/10.4071/isom-TA25
IMAPSource Conference Papers
Kandaswamy, Shri Vishnu, Ulrich Tetzlaff, Robert Derix, and Gordon Elger. 2014. “Analysis of Crack Length and Crack Position in the Solder Joints of High Power LEDs by Transient Thermal Measurements and Finite Element Simulations.” IMAPSource Proceedings 2014 (1): 55–61. https://doi.org/10.4071/isom-TA25.
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