Vol. 2020, Issue 1, 2020September 01, 2020 EDT
Enhancement of Board Level Reliability on Automotive DRAM Package by Optimized Thermal & Mechanical Properties
Enhancement of Board Level Reliability on Automotive DRAM Package by Optimized Thermal & Mechanical Properties
Lee, Jong-Gi, Jin-Soo Bae, Yeo-Hoon Yoon, Jun-Ho Lee, and Kang-Young Cho. 2020. “Enhancement of Board Level Reliability on Automotive DRAM Package by Optimized Thermal & Mechanical Properties.” IMAPSource Proceedings 2020 (1): 73–77. https://doi.org/10.4071/2380-4505-2020.1.000073.