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Symposium Proceedings
Vol. 2020, Issue 1, 2020
September 01, 2020 EDT
Enhancement of Board Level Reliability on Automotive DRAM Package by Optimized Thermal & Mechanical Properties
Jong-Gi Lee
,
Jin-Soo Bae
,
Yeo-Hoon Yoon
,
Jun-Ho Lee
,
Kang-Young Cho
,
Automotive Package
Board Level Reliability
Solder Joint Enhancement
Joint Strengthening
•
https://doi.org/10.4071/2380-4505-2020.1.000073
IMAPSource Conference Papers
Lee, Jong-Gi, Jin-Soo Bae, Yeo-Hoon Yoon, Jun-Ho Lee, and Kang-Young Cho. 2020. “Enhancement of Board Level Reliability on Automotive DRAM Package by Optimized Thermal & Mechanical Properties.”
IMAPSource Proceedings
2020 (1): 73–77.
https://doi.org/10.4071/2380-4505-2020.1.000073
.
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