Enhancement of Board Level Reliability on Automotive DRAM Package by Optimized Thermal & Mechanical Properties

Jong-Gi Lee; Jin-Soo Bae; Yeo-Hoon Yoon; Jun-Ho Lee; Kang-Young Cho

doi:10.4071/2380-4505-2020.1.000073

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Lee, Jong-Gi, Jin-Soo Bae, Yeo-Hoon Yoon, Jun-Ho Lee, and Kang-Young Cho. 2020. “Enhancement of Board Level Reliability on Automotive DRAM Package by Optimized Thermal & Mechanical Properties.” IMAPSource Proceedings 2020 (1): 73–77. https://doi.org/10.4071/2380-4505-2020.1.000073.

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