Development of Through Glass Vias (TGV) for 3D-IC Integration

Shorey, Aric, Scott Pollard, and John Keech. 2012. “Development of Through Glass Vias (TGV) for 3D-IC Integration.” IMAPSource Proceedings 2012 (1): 765–69. https://doi.org/10.4071/isom-2012-WP12.