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Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

Fabrication of an advanced epoxy based molding compound with high thermal conductivity and outstanding mechanical properties

Nazila Dadvand, Mina Dadvand, Georges Kipouros,
epoxy based molding compoundthermal conductivitymechanical propertiesnovel moldingaluminum particlesresinaluminaultrasonic treatmenthydrogen peroxide
https://doi.org/10.4071/2380-4505-2018.1.000298
IMAPSource Conference Papers
Dadvand, Nazila, Mina Dadvand, and Georges Kipouros. 2018. “Fabrication of an Advanced Epoxy Based Molding Compound with High Thermal Conductivity and Outstanding Mechanical Properties.” IMAPSource Proceedings 2018 (1): 298–304. https:/​/​doi.org/​10.4071/​2380-4505-2018.1.000298.
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