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Symposium Proceedings
Vol. 2014, Issue 1, 2014
January 01, 2014 EDT
Thick Film Technology For Today’s Hearing Products
John Dzarnoski
,
Susie Johansson
,
Integrated Passive Device (IPD)
Chip-on-flip chip (COFC)
Vertical Interconnect (VIC)
Multi-chip module (MCM) and System in a Package (SIP)
•
https://doi.org/10.4071/isom-TP53
IMAPSource Conference Papers
Dzarnoski, John, and Susie Johansson. 2014. “Thick Film Technology For Today’s Hearing Products.”
IMAPSource Proceedings
2014 (1): 325–30.
https://doi.org/10.4071/isom-TP53
.
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