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Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Characterization of Over Pad Metallization (OPM) for High Temperature Reliability

Varughese Mathew, Tu Anh Tran,
Au wire bonding Cu wire bonding electroless Ni/Pd/Au automotive reliability
• https://doi.org/10.4071/isom-2012-THP32
IMAPSource Conference Papers
Mathew, Varughese, and Tu Anh Tran. 2012. “Characterization of Over Pad Metallization (OPM) for High Temperature Reliability.” IMAPSource Proceedings 2012 (1): 1097–1104. https://doi.org/10.4071/isom-2012-THP32.
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