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Symposium Proceedings
Vol. 2012, Issue 1, 2012
January 01, 2012 EDT
Characterization of Over Pad Metallization (OPM) for High Temperature Reliability
Varughese Mathew
,
Tu Anh Tran
,
Au wire bonding
Cu wire bonding
electroless Ni/Pd/Au
automotive reliability
•
https://doi.org/10.4071/isom-2012-THP32
IMAPSource Conference Papers
Mathew, Varughese, and Tu Anh Tran. 2012. “Characterization of Over Pad Metallization (OPM) for High Temperature Reliability.”
IMAPSource Proceedings
2012 (1): 1097–1104.
https://doi.org/10.4071/isom-2012-THP32
.
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