Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Development on Silicon module with Cu-filled TSV and Integrated Passive Devices
Development on Silicon module with Cu-filled TSV and Integrated Passive Devices
Park, Yun-Mook, Jun-Kyu Lee, Byung-Jin Park, Byeung-Gee Kim, Jung-Won Lee, and In-Soo Kang. 2010. “Development on Silicon Module with Cu-Filled TSV and Integrated Passive Devices.” IMAPSource Proceedings 2010 (1): 385–91. https://doi.org/10.4071/isom-2010-WA1-Paper6.
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