Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Rheology Considerations for Jet Dispensing and Die Placement
Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Rheology Considerations for Jet Dispensing and Die Placement
Duffy, Daniel, Hemal Bhavsar, Lin Xin, Jean Liu, and Bruno Tolla. 2015. “Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Rheology Considerations for Jet Dispensing and Die Placement.” IMAPSource Proceedings 2015 (1): 856–61. https://doi.org/10.4071/isom-2015-THP44.