Vol. 2015, Issue 1, 2015October 01, 2015 EDT
A High Performance Power Package for Wide Bandgap Semiconductors Using Novel Wire Bondless Power Interconnections
A High Performance Power Package for Wide Bandgap Semiconductors Using Novel Wire Bondless Power Interconnections
Stabach, Jennifer, Zach Cole, Chad B. O’Neal, Brice McPherson, Robert Shaw, and Brandon Passmore. 2015. “A High Performance Power Package for Wide Bandgap Semiconductors Using Novel Wire Bondless Power Interconnections.” IMAPSource Proceedings 2015 (1): 353–58. https://doi.org/10.4071/isom-2015-WP16.