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Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

A High Performance Power Package for Wide Bandgap Semiconductors Using Novel Wire Bondless Power Interconnections

Jennifer Stabach, Zach Cole, Chad B. O'Neal, Brice McPherson, Robert Shaw, Brandon Passmore,
Power density power packaging silicon carbide (SiC) wire bonds wide bandgap
• https://doi.org/10.4071/isom-2015-WP16
IMAPSource Conference Papers
Stabach, Jennifer, Zach Cole, Chad B. O’Neal, Brice McPherson, Robert Shaw, and Brandon Passmore. 2015. “A High Performance Power Package for Wide Bandgap Semiconductors Using Novel Wire Bondless Power Interconnections.” IMAPSource Proceedings 2015 (1): 353–58. https://doi.org/10.4071/isom-2015-WP16.
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