Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Process integration solution for damage-free bevel for deep Si etch applications
Process integration solution for damage-free bevel for deep Si etch applications
Majeed, Bivragh, Nina Tutunjyan, Paolo Fiorini, and Deniz. S. Tezcan. 2012. “Process Integration Solution for Damage-Free Bevel for Deep Si Etch Applications.” IMAPSource Proceedings 2012 (1): 169–75. https://doi.org/10.4071/isom-2012-TA55.