Process integration solution for damage-free bevel for deep Si etch applications

Bivragh Majeed; Nina Tutunjyan; Paolo Fiorini; Deniz. S. Tezcan

doi:10.4071/isom-2012-TA55

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Majeed, Bivragh, Nina Tutunjyan, Paolo Fiorini, and Deniz. S. Tezcan. 2012. “Process Integration Solution for Damage-Free Bevel for Deep Si Etch Applications.” IMAPSource Proceedings 2012 (1): 169–75. https://doi.org/10.4071/isom-2012-TA55.

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