Evaluation of electromigration in flip-chip solder joints

Hyun-Kyu Lee; Yong-Chul Chu; Myung-Ho Chun; Sang-Ho Jeon; Jung-Ug Kwak; Seung-Jin Lee; Sung-Mun Bae

doi:10.4071/isom-2011-THA3-Paper4

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Lee, Hyun-Kyu, Yong-Chul Chu, Myung-Ho Chun, Sang-Ho Jeon, Jung-Ug Kwak, Seung-Jin Lee, and Sung-Mun Bae. 2011. “Evaluation of Electromigration in Flip-Chip Solder Joints.” IMAPSource Proceedings 2011 (1): 979–84. https://doi.org/10.4071/isom-2011-THA3-Paper4.

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