Evaluation of electromigration in flip-chip solder joints

Lee, Hyun-Kyu, Yong-Chul Chu, Myung-Ho Chun, Sang-Ho Jeon, Jung-Ug Kwak, Seung-Jin Lee, and Sung-Mun Bae. 2011. “Evaluation of Electromigration in Flip-Chip Solder Joints.” IMAPSource Proceedings 2011 (1): 979–84. https:/​/​doi.org/​10.4071/​isom-2011-THA3-Paper4.