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Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

A Systematic Approach to the Reliability Characterization of System in Package (SiP)

Karthikeyan Dhandapani, Brian Roggeman, David Rae,
System-in-Package (SiP) Module Warpage Digital Image Correlation (DIC) Finite Element (FE)Modeling Coefficient of thermal expansion (CTE) Solder Joint Reliability (SJR)
• https://doi.org/10.4071/2380-4505-2018.1.000186
IMAPSource Conference Papers
Dhandapani, Karthikeyan, Brian Roggeman, and David Rae. 2018. “A Systematic Approach to the Reliability Characterization of System in Package (SiP).” IMAPSource Proceedings 2018 (1): 186–92. https://doi.org/10.4071/2380-4505-2018.1.000186.
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