A 3D System-in-Package for RF Applications

Shihwen Lu; Chanlin Yeh; Gavin Kao; YE Yeh; Harrison Chang

doi:10.4071/2380-4505-2018.1.000001

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Lu, Shihwen, Chanlin Yeh, Gavin Kao, YE Yeh, and Harrison Chang. 2018. “A 3D System-in-Package for RF Applications.” IMAPSource Proceedings 2018 (1): 1–4. https://doi.org/10.4071/2380-4505-2018.1.000001.

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