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Symposium Proceedings
Vol. 2014, Issue 1, 2014
January 01, 2014 EDT
Pre-applied Inter Chip Fill for 3D-IC Joining
Y. Kawase
,
M. Ikemoto
,
M. Sugiyama
,
H. Kiritani
,
F. Mizutani
,
K. Matsumoto
,
H. Mori
,
Y. Orii
,
3D-IC
Inter chip fill
Pre-applied joining
•
https://doi.org/10.4071/isom-TP31
IMAPSource Conference Papers
Kawase, Y., M. Ikemoto, M. Sugiyama, H. Kiritani, F. Mizutani, K. Matsumoto, H. Mori, and Y. Orii. 2014. “Pre-Applied Inter Chip Fill for 3D-IC Joining.”
IMAPSource Proceedings
2014 (1): 242–46.
https://doi.org/10.4071/isom-TP31
.
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