Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Conceptual Development Using 3D Printing Technologies for 8kV SiC Power Module Package
Conceptual Development Using 3D Printing Technologies for 8kV SiC Power Module Package
Ke, Haotao, Yang Xu, and Douglas C Hopkins. 2013. “Conceptual Development Using 3D Printing Technologies for 8kV SiC Power Module Package.” IMAPSource Proceedings 2013 (1): 758–63. https://doi.org/10.4071/isom-2013-WP62.
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