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Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

Technique to predict reliability failure in side-gate transfer molded packages

Nishant Lakhera, Tom Battle, Sheila Chopin, Sandeep Shantaram, Akhilesh K. Singh,
Delaminationepoxy mold compoundpredictive reliabilitythermal cyclingtransfer molded packages
https://doi.org/10.4071/isom-2015-THA61
IMAPSource Conference Papers
Lakhera, Nishant, Tom Battle, Sheila Chopin, Sandeep Shantaram, and Akhilesh K. Singh. 2015. “Technique to Predict Reliability Failure in Side-Gate Transfer Molded Packages.” IMAPSource Proceedings 2015 (1): 696–701. https:/​/​doi.org/​10.4071/​isom-2015-THA61.
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