Electrografted insulator layer as copper diffusion barrier for TSV interposers

V. Mevellec; F. Raynal; D. Suhr; T. Dequivre; L. Religieux

doi:10.4071/isom-2013-TA16

Loading [Contrib]/a11y/accessibility-menu.js

Mevellec, V., F. Raynal, D. Suhr, T. Dequivre, and L. Religieux. 2013. “Electrografted Insulator Layer as Copper Diffusion Barrier for TSV Interposers.” IMAPSource Proceedings 2013 (1): 22–25. https://doi.org/10.4071/isom-2013-TA16.

View more stats