Package Thickness - Ultrathin WLFO (Wafer-Level Fan-Out)

O’Toole, Eoin, Steffen Kroehnert, José Campos, Virgilio Barbosa, and Leonor Dias. 2016. “Package Thickness - Ultrathin WLFO (Wafer-Level Fan-Out).” IMAPSource Proceedings 2016 (1): 305–8. https://doi.org/10.4071/isom-2016-WP31.