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Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
Package Thickness - Ultrathin WLFO (Wafer-Level Fan-Out)
Eoin O'Toole
,
Steffen Kroehnert
,
José Campos
,
Virgilio Barbosa
,
Leonor Dias
,
Package Thickness
Ultrathin WLFO
Wafer-Level Fan-Out
wafer-level ball grid array
eWLB
KGD
known good die
•
https://doi.org/10.4071/isom-2016-WP31
IMAPSource Conference Papers
O’Toole, Eoin, Steffen Kroehnert, José Campos, Virgilio Barbosa, and Leonor Dias. 2016. “Package Thickness - Ultrathin WLFO (Wafer-Level Fan-Out).”
IMAPSource Proceedings
2016 (1): 305–8.
https://doi.org/10.4071/isom-2016-WP31
.
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