Vol. 2018, Issue 1, 2018October 01, 2018 EDT
A comparison of the Cu electrochemical migration behavior between Cu lines with 5 um L/S realized by conventional Semi Additive Process (SAP) and an innovative Excimer Laser Damascene Process
A comparison of the Cu electrochemical migration behavior between Cu lines with 5 um L/S realized by conventional Semi Additive Process (SAP) and an innovative Excimer Laser Damascene Process
Gernhardt, Robert, Friedrich Müller, Markus Woehrmann, Habib Hichri, Karin Hauck, Markus Arendt, and Klaus-Dieter Lang. 2018. “A Comparison of the Cu Electrochemical Migration Behavior between Cu Lines with 5 Um L/S Realized by Conventional Semi Additive Process (SAP) and an Innovative Excimer Laser Damascene Process.” IMAPSource Proceedings 2018 (1): 140–45. https://doi.org/10.4071/2380-4505-2018.1.000140.
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