ISSN 2380-4505
Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Microstructural investigations of aluminum and copper wire bonds
Microstructural investigations of aluminum and copper wire bonds
Florian Eacock, Mirko Schaper, Simon Althoff, Andreas Unger, Paul Eichwald, Florian Hengsbach, Carolin Zinn, Martin Joachim Holzweissig, Karsten Guth,
Eacock, Florian, Mirko Schaper, Simon Althoff, Andreas Unger, Paul Eichwald, Florian Hengsbach, Carolin Zinn, Martin Joachim Holzweissig, and Karsten Guth. 2014. “Microstructural Investigations of Aluminum and Copper Wire Bonds.” IMAPSource Proceedings 2014 (1): 845–49. https://doi.org/10.4071/isom-THP32.