Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Additive Manufacturing of Fine Lines and Embedded Electronics for use in Chip Carriers and Microelectronic Systems

Scott Lauer, Whitten Little, Pier Benci, Tim Schmitt, John Mazurowski,
Fine Lines Additive Manufacturing Evaporation-Printing Thin Film Embedded Components
• https://doi.org/10.4071/isom-2012-WP53
IMAPSource Conference Papers
Lauer, Scott, Whitten Little, Pier Benci, Tim Schmitt, and John Mazurowski. 2012. “Additive Manufacturing of Fine Lines and Embedded Electronics for Use in Chip Carriers and Microelectronic Systems.” IMAPSource Proceedings 2012 (1): 946–48. https://doi.org/10.4071/isom-2012-WP53.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system