Fine Pitch Cu Wire Bonding Capability – Process Optimization and Reliability Study

Ivy Qin; Hui Xu; Cuong Huynh; Bob Chylak; Hidenori Abe; Dongchul Kang; Yoshinori Endo; Masahiko Osaka; Shinya Nakamura

doi:10.4071/isom-TP43

Loading [Contrib]/a11y/accessibility-menu.js

Qin, Ivy, Hui Xu, Cuong Huynh, Bob Chylak, Hidenori Abe, Dongchul Kang, Yoshinori Endo, Masahiko Osaka, and Shinya Nakamura. 2014. “Fine Pitch Cu Wire Bonding Capability – Process Optimization and Reliability Study.” IMAPSource Proceedings 2014 (1): 283–88. https://doi.org/10.4071/isom-TP43.

View more stats