Vol. 2010, Issue 1, 2010January 01, 2010 EDT
A Novel TSV Etching using NLD and VHF CCP Plasma For 3-D Stacked Devices.
A Novel TSV Etching using NLD and VHF CCP Plasma For 3-D Stacked Devices.
Morikawa, Yasuhiro, Takahide Murayama, Manabu Yoshii, and Koukou Suu. 2010. “A Novel TSV Etching Using NLD and VHF CCP Plasma For 3-D Stacked Devices.” IMAPSource Proceedings 2010 (1): 180–84. https://doi.org/10.4071/isom-2010-TP1-Paper4.
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