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Symposium Proceedings
Vol. 2010, Issue 1, 2010January 01, 2010 EDT

Compression Molding for Thin PoP Top Packages

Ravikumar Adimula, Jason Brand, Myung Jin Yim, James Zhang, Richard Strode, Chan Yoo,
package on packagecompression moldwarpagegranular
https://doi.org/10.4071/isom-2010-WP1-Paper4
IMAPSource Conference Papers
Adimula, Ravikumar, Jason Brand, Myung Jin Yim, James Zhang, Richard Strode, and Chan Yoo. 2010. “Compression Molding for Thin PoP Top Packages.” IMAPSource Proceedings 2010 (1): 554–58. https:/​/​doi.org/​10.4071/​isom-2010-WP1-Paper4.

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