Compression Molding for Thin PoP Top Packages

Ravikumar Adimula; Jason Brand; Myung Jin Yim; James Zhang; Richard Strode; Chan Yoo

doi:10.4071/isom-2010-WP1-Paper4

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Adimula, Ravikumar, Jason Brand, Myung Jin Yim, James Zhang, Richard Strode, and Chan Yoo. 2010. “Compression Molding for Thin PoP Top Packages.” IMAPSource Proceedings 2010 (1): 554–58. https://doi.org/10.4071/isom-2010-WP1-Paper4.

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